Translations*

2.008 Design and Manufacturing II

As taught in: Spring 2004

Bulk micromachined silicon bonded on top of pyrex with a back side hole.

A diagram showing bulk micromachined silicon bonded on top of pyrex with a back side hole. The membrane deflection is measured by four piezoresistors forming a Wheatstone bridge to get the pressure from the back side hole. (Image courtesy of OCW.)

Level:

Undergraduate

Instructors:

Prof. Jung-Hoon Chun

Prof. Sang-Gook Kim

Course Features

Course Description

This course introduces you to modern manufacturing with four areas of emphasis: manufacturing processes, equipment/control, systems, and design for manufacturing. The course exposes you to integration of engineering and management disciplines for determining manufacturing rate, cost, quality and flexibility. Topics include process physics, equipment design and automation/control, quality, design for manufacturing, industrial management, and systems design and operation. Labs are integral parts of the course, and expose you to various manufacturing disciplines and practices.


*Some translations represent previous versions of courses.